塑封器件去潮工艺研究

Research on Baking Process of Plastic Packaging Devices

塑封元器件在存储期间,由于其自身的材料和结构问题,会吸收周围空气中的水分。在进行焊接时,温度的急剧上升使器件内部受到湿应力和蒸汽压力的作用,从而产生内部分层或“爆米花”效应。因此长期存放的塑封器件在焊前要进行烘烤以驱除内部的潮气。针对实际的塑封钽电容器件的去潮工艺进行了分析,对常压和真空条件下去潮的工艺进行了对比。提出了高效的真空去潮工艺方法。

Plastic packaging devices absorb moisture due to material and structure during stored period. During soldering,the sharp rise of temperature makes the devices subjected to hygrothermal stress,resulting in internal delamination or "popcorn" crack.Therefore,it is necessary to bake those long-stored devices before soldering in order to drive out moisture.The baking process of plastic packaging tantalum capacitors is analyzed,and the baking process by vacuum is compared with the process by ordinary pressure.An efficient baking process has been put forward.