摘要
LED因其优异性能被广泛应用于新能源汽车领域,但大功率LED常常面临着热管理问题,多颗集成的封装结构所产生的高热量对自身器件造成很大的危害,因此对于大功率LED的散热研究意义重大。文章从封装结构及封装材料角度,提出了石墨烯在大功率GaN基LED的应用方案,并通过模拟仿真分析,对比了石墨烯应用前后LED的散热情况,结果表明石墨烯的应用可以有效增强器件的散热能力,属于一种新型的散热方式。
LED is widely used in the field of new energy vehicles for its excellent performances. However, high-power LED often faces the problem of thermal management. The high heat generated by multiple integrated packaging structures causes great harm to its parts, so it is of great significance to study the heat dissipation of the high-power LED from the perspective of its structure and materials for packaging. This paper proposes to apply the graphene in high-power GaN-based LED for a before and after comparison of the heat dissipation of LED through simulation analysis. The results show that the application of graphene can effectively enhance the heat dissipation capacity of the parts, which would be a new heat dissipation mode.
作者
靖南
许媛
鲍婕
徐文艺
周斌
Jing Nan;Xu Yuan;Bao Jie;Xu Wenyi;Bin Zhou(College of Mechanical and Electrical Engineering, Huangshan University, Huangshan 245041, China;Institute of Semiconductor Technologies and Microsystem, Huangshan University, Huangshan 245041, China;Huangshan Bonnie Two-Dimensional New Material Technology Co., Ltd, Huangshan 245900, China;Huangshan Googe Thermal Cooling Technology Co., Ltd, Huangshan 245061, China)
出处
《黄山学院学报》
2019年第5期22-25,共4页
Journal of Huangshan University
基金
黄山谷捷热科技有限公司委托项目(hxkt20180044)
黄山学院校地合作项目(2017XDHZ020)
国家级大学生创新创业训练计划项目(201810375001
201810375004)
关键词
GAN
LED
封装
石墨烯
散热
GaN
LED
packaging
graphene
heat dissipation