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FeCl3蚀刻Cu的废液的再生研究 被引量:1

Regeneration of FeCl3 etching Cu waste water
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摘要 用阴极除杂-阳极氧化三氯化铁蚀刻废液的电化学方法再生三氯化铁蚀刻铜的废液。结果表明,8V为较合适的电解槽压,温度为25℃,极距为80mm时ORP转化情况最好。由于电解实验中Fe^2+的转化率比较低,因此对再生液的蚀刻能力进行研究,得出可循环使用次数最少为3次。总铜离子含量检测表明,再生一次后的溶液中的Cu^2+去除率为68.5%。由于Cu^2+去除率比较低,进而探究Cu^2+含量对蚀刻能力的影响,表明当Cu^2+浓度为0.119g/mL是蚀刻能力的一个临界值,浓度升高溶液的蚀刻能力变低。因此实际应用中,以8V电压25℃、80mm极距可最大化的提高循环利用率,实现废液的再生利用。 The electrochemical method of cathode impurity removal and anode oxidation of ferric chloride etching waste solution was used to regenerate the copper etching waste solution of ferric chloride.The experimental results show that the 8 V for suitable cell pressure,the temperature is 25 ℃,when polar distance is 80 mm ORP transformation is the best.As Fe^2+ had a low conversion rate in the electrolysis experiment,the etching ability of the regenerated solution was studied,and it was concluded that the number of times of recycling was at least 3.The Cu^2+ removal rate of the regenerated solution was 68.5%.Since the Cu^2+ removal rate is relatively low,the influence of Cu^2+ content on the etching ability is further explored.When the Cu^2+ concentration is 0.119 g/mL,which is a critical value of the etching ability,the etching ability of the solution becomes lower as the concentration increases.So in the practical application to 8 V voltage 25 ℃,and 80 mm pole pitch can be maximized to improve circulation utilization and realize the recycle of waste liquid.
作者 杨俏 敖思琦 于洁 周婉秋 田鹏 康艳红 YANG Qiao;AO Si-qi;YU Jie;ZHOU Wan-qiu;TIAN Peng;KANG Yan-hong(College of Chemistry and Chemical Engineering,Shenyang Normal University,The Engineering Technology Research Center of Catalysis for Energy and Environment,Major Platform forScience and Technology of the Universities in Liaoning Province,Liaoning Key Laboratory of Special MaterialsPreparation and Application Technology,Shenyang 110034,China)
出处 《应用化工》 CAS CSCD 北大核心 2019年第10期2335-2338,2349,共5页 Applied Chemical Industry
基金 国家自然科学基金(51271127) 辽宁省高校重大科技平台开放课题(2017-15) 沈阳市科技计划项目(17-76-1-00)
关键词 FECL3 蚀刻液 再生 氧化还原电位 FeCl3 etching liquid regeneration ORP
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