MOS型气体传感器加热板的结构优化

Structure Optimization of Heating Plate for MOS Gas Sensor

针对半导体金属氧化物(MOS)气体传感器功耗大的问题,对加热电极的线宽和间距做了优化,用有限元仿真软件COMSOL对加热板进行模拟分析,并对加热板温度进行测试。为进一步降低功耗,提高温度均匀性,提出在加热电极一侧添加一层电绝缘、热绝缘的包覆膜。对添加不同材料不同厚度包覆膜的加热板进行模拟分析,并用红外热像仪对加热板的温度分布进行测试。结果表明,添加包覆膜可降低功耗,提高温度均匀性,提高传感器响应速率,且包覆膜越薄越好。

For the problem of high power consumption of semiconductor metal oxide(MOS)gas sensors,the line width and spacing of the heating electrodes was optimized.The heating plate was simulated with the finite element simulation software COMSOL,and the temperature of the heating plate was tested.In order to further reduce the power consumption and improve the temperature uniformity,it was proposed to add a coating film on the side of the heating electrodes,which is electrically insulated and thermally insulated.The heating plate was coated with different materials and different thickness,and the heating plate was simulated.The temperature distribution of the heating plate was tested with an infrared thermal imager.The results show that the addition of the coating film can reduce power consumption,improve the temperature uniformity and improve sensor response rate.In addition,the thinner the coating film,the better.