碲锌镉晶片研抛加工表面层损伤的研究

Study on the Surface Layer Damage of CZT Wafer Induced by Lapping and Polishing

介绍了碲锌镉晶片背面研抛机的工艺过程和原理,研究了研抛工艺中砂轮粒度、砂轮进给率、砂轮转速和工作台转速对晶片表面层损伤深度的影响。

In this paper,the process and principle of the CZT wafer lapping and polishing machine are introduced,the effect of the lapping and polishing wheel type,the wheel infeed rate,the wheel rotation speed and the chuck rotation speed on the wafer surface layer damage are studied.