摘要
激光钻孔与激光蚀刻是大面积电子基板(如印刷电路板)的主要制图方法,毫无疑问也将大量应用在柔性电路和印刷电子产品中。然而,许多应用在这些制程中的塑性材料并不能有效地被激光蚀刻,并且残留物难以移除。此外,同样的材料有些要求经高温处理,这也和一些设备要求并不兼容。这种新型可光固化热塑性材料在激光钻孔和蚀刻中常用的中紫外(UV)波段拥有高光密度。因此,这种新材料展现出快速清洁蚀刻的特性。这种新型材料具有热塑性,紫外光固化,以及热固化等性质,可在低于200℃的温度下进行处理,并且拥有所需的机械强度与韧性,以及热稳定性和化学稳定性,因此可用作微电子基板、介电材料、粘性材料、填缝涂料以及钝化层。
Laser drilling and laser etching are preferred methods for patterning large-area electronic substrates such as printed circuit boards and will undoubtedly find extensive use in the production of flexible circuits and printed electronics.However,many of the plastic materials now being employed in these processes do not etch efficiently under laser exposure and/or leave behind residues that are difficult to remove.Some of these same materials also require high processing temperatures that are incompatible with the device or the balance of the package.The new PCT materials possess high optical density at the mid-ultraviolet wavelengths commonly used for laser drilling and etching.As a result,they exhibit very fast and clean etching.The new materials include thermoplastic,UV-curable,and thermosetting compositions that can be processed at≤200℃and have the requisite strength and toughness along with the thermal and chemical stability to serve as microelectronic substrates,dielectrics,adhesives,gap-filling coatings,and passivation layers.
出处
《电子工业专用设备》
2019年第5期38-42,共5页
Equipment for Electronic Products Manufacturing
