超疏水铜表面的制备及其润湿行为研究

Study on preparation and wetting behavior of superhydrophobic copper surface

以铜为基体材料,采用简单的化学刻蚀法,用HCl,HNO3,HF组成的混酸溶液(化学刻蚀液A)和FeCl3,HCl组成的混合溶液(化学刻蚀液B)两种不同的刻蚀液制备具有超疏水性能的铜表面,研究其润湿行为,并选择化学刻蚀液B,考察刻蚀时间、FeCl3添加量、烘干温度、HCl添加量4个主要因素对所得铜表面润湿行为的影响.结果表明:1)使用两种刻蚀液所得铜表面的接触角分别为158. 6°和153. 6°,该表面具有超疏水性能;2)刻蚀时间、FeCl3添加量、烘干温度、HCl添加量与接触角均先呈正相关后呈负相关关系,所得最大接触角分别为153. 6°,152. 6°,153. 5°,152. 0°,相应上述条件分别为100 min,2 g/L,120℃,3 mL/L.

With copper as the base material,using simple chemical etching,the mixed acid solution of HCl,HNO3,HF( chemical etching solution A) and mixed solution of FeCl3,HCl( chemical etching solution B)was used to prepare the copper surface with superhydrophobic properties,and the wetting behavior was studied. The chemical etching solution B was selected to investigate the influence of main factors( etching time,FeCl3 addition amount,drying temperature,HCl addition amount) on the surface wetting behavior of the obtained copper. The results showed that the contact angles of the copper surface obtained by using the two electrolytes were 158. 6° and 155. 6°,respectively,and the surface had superhydrophobic properties. The etching time,FeCl3 addition amount,drying temperature,HCl addition amount and contact angle were positively correlated and then negatively correlated. The maximum contact angles were 153. 6°,152. 6°,153. 5°and 152. 0°,respectively. The corresponding conditions were 100 min,2 g/L,120 ℃,3 mL/L.