钇系涂层超导体金属基带再结晶织构及显微组织

Recrystallization Texture and Microstructure of Metal Substrate for Y123 Coated Conductor

用轧制 再结晶热处理方法制备了强立方织构的纯Ni基带和无磁性Cu Ni合金基带 ,为第二代钇钡铜氧高温超导带材提供了较好的基带材料。用三维取向分布函数 (ODF)和 φ扫描曲线研究了织构 ,用金相显微镜研究了截面显微组织。分析表明 ,Cu0 .70 Ni0 .3 0 合金和纯Ni在再结晶温度为 10 0 0℃时 ,获得最强的立方织构 ;Cu0 .85Ni0 .1 5在 90 0℃时获得最强的立方织构 ,立方织构强度大小各不相同 ;3种不同组分金属都获得了均匀的等轴晶粒组织 ,其中Cu0 .85Ni0 .1 5的晶粒大于Cu0 .70 Ni0 .3 0 和纯Ni的晶粒 ;Cu0 .85Ni0 .1 5和Cu0 .70 Ni0 .3 0

The cube textured pure Ni and non-magnetic Cu-Ni tapes were obtained by rolling and recrystallization and these tapes are suitable for substrates for second generation high temperature superconducting tape. The texture of tapes was studied using Orientation Distribution Function (ODF) and φ-scans. The results indicate that sharp cube texture of Cu_ 0.70Ni_ 0.30 and pure Ni is formed at 1000 ℃ and of Cu_ 0.85Ni_ 0.15 is formed at 900 ℃. The intensity of cube texture differs from each other. The uniform equiaxial crystallite is obtained in all the tapes and the size of Cu_ 0.85Ni_ 0.15 is bigger than that of Cu_ 0.70Ni_ 0.30 and pure Ni. Annealing twin is formed in Cu_ 0.85Ni_ 0.15 and Cu_ 0.70Ni_ 0.30.