工艺条件对化学镀Ni-Co-P合金的影响

Effect of Process Conditions on Electroless Ni-Co-P alloy

采用硼酸为缓冲剂 ,柠檬酸钠为络合剂化学镀Ni Co P合金。考察了镀液pH值、钴离子浓度和温度对化学镀Ni Co P沉积速度的影响 ;研究了钴离子浓度对镀层组成的影响 ,获得了化学镀Ni Co P合金的最佳工艺条件为 :镀液pH值为 7.0 ,操作温度 90℃ ,CoSO4 ·7H2 O浓度为 11g/L。此工艺下镀液稳定性好 ,镀层沉积速度快 ;所得镀层为非晶结构。

The electroless Ni\|Co\|P alloys were deposited from bath using H\-3BO\-3 as buffer agent and sodium citrate as complexing agent. The effects of pH, concentration of Co\+\{2+\} and temperature on depositing rate were studied including the effect of concentration of Co\+\{2+\} on the composition of deposit. Formula of electroless Ni\|Co\|P alloys plating was optimized so as to obtain high depositing rate and good stable bath that pH was 7.0, temperature was 90 ℃ and CoSO\-4·7H\-2O content was 11 g/L. The Ni\|Co\|P plating was an amorphous structure.