化学镀Ni-P-SiC镀层的微观组织结构特征

Interface Microstructure Between SiC and Ni-P of Electroless Ni-P-SiC Composite Coatings

对化学镀Ni P SiC复合镀层的微观组织结构特征进行了研究 ,结果表明 ,SiC微粒弥散分布在复合镀层中 ,Ni P合金主要作为粘结金属包络着SiC微粒 ,两者之间存在电子转移 ,发生了界面反应 ,反应扩散层为 10 - 1nm级 ,界面结合紧密 ,无孔隙和裂纹等缺陷。元素存在形态主要表现为Ni和P以单质的形式存在 ,Si以共价健SiC的形式存在 ,Ni

Microstructure of electroless Ni-P-SiC composite coatings had been explored. The results revealed that SiC particles surrounded by Ni-P were dispersed homogeneously in the coating and there was an electron transfer between SiC and Ni-P. The thickness of interface reaction layer was the degree of 10 -1nm. SiC particles were fine and compact in the coating. No cracks and holes had been detected. Presence of elements Ni, P and Si were in the simple state of metallic bond Ni, P element and covalent bond SiC, respectively.