摘要
介绍 5种制备低热膨胀聚酰亚胺的方法 :共聚物掺混、多元共聚、添加填料或其他化合物、有机硅氧烷改性及纳米杂化法以及低热膨胀聚酰亚胺在半导体绝缘膜、α射线屏蔽膜。
The progress of polyimides in the low thermal expansion coefficient and it′s manufactures and applications were summarized. The preparation methods of polyimide with low thermal expansion coefficient were reviewed. These methods are copolymers blending, multiple copolymerization, adding fillers, modification with organo-silicone, and nano-hybrids. The application of the polyimides with low thermal expansion coefficient in microelectronics technology such as flexible printing circuit plate was summarized.
出处
《高分子材料科学与工程》
EI
CAS
CSCD
北大核心
2002年第6期29-31,共3页
Polymer Materials Science & Engineering
关键词
研究进展
聚酰亚胺
低热膨胀系数
制备
应用
polyimides
low thermal expansion coefficient
preparation
application
