直接电镀导体吸附液的保养
被引量：2
Maintenace of Conductor Adsorption Solution for Direct Electroplating
摘要
对安美特化学有限公司推出一种新型的孔金属化工艺——直接电镀的工艺流程及机理进行了简介 ,并着重分析了直接电镀的关键点——导体吸附液中钯粒子胶体的形成机理 。
出处
《电镀与精饰》
CAS
2002年第6期12-14,共3页
Plating & Finishing
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