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Coexistance of C40 and C54 TiSi_2 during the solid statereaction of Ti/Mo/Si system 被引量:1

Coexistance of C40 and C54 TiSi_2 during the solid state reaction of Ti/Mo/Si system
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摘要 The effect of a 0.9 nm Mo interlayer at the interface of Ti film deposited on a Si substrate on phase formation of TiSi2 during annealing has been studied by using transmission electron micro-diffraction technique. When Ti/Mo/Si was an- nealed at low temperature as 550℃ for 30 mm in Ar ambient, a metastable phase. i.e., hexagonal C40 TiSi2, and the equilibrium phase. i.e., orthorhombic C54 TiSi2, were both detected. The experimental patterns of the C40 and C54 compare well with the simulated ones. The effect of a 0.9 nm Mo interlayer at the interface of Ti film deposited on a Si substrate on phase formation of TiSi2 during annealing has been studied by using transmission electron micro-diffraction technique. When Ti/Mo/Si was an- nealed at low temperature as 550℃ for 30 mm in Ar ambient, a metastable phase. i.e., hexagonal C40 TiSi2, and the equilibrium phase. i.e., orthorhombic C54 TiSi2, were both detected. The experimental patterns of the C40 and C54 compare well with the simulated ones.
出处 《Nuclear Science and Techniques》 SCIE CAS CSCD 2002年第1期19-24,共6页 核技术(英文)
基金 Partly Supported by the National Nature Science Foundation of China (No. 19910131370)
关键词 钛薄膜 硅衬底 TiSi2相 电子衍射 Transmission electron micro-diffraction, Phase of TiSi2, C54, C40 CLC numbers TN304.1+2. TN304.2+6. TN305.3, O472+.1
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  • 1郝好山,张献图.SOI技术的现状、趋势和挑战[J].河南教育学院学报(自然科学版),2000,9(2):25-27. 被引量:1
  • 2M R Baklanov. Application of HF solutions for the clearning of TiSi2 surface [ J ], Materials for Advanced Metallization, 1997 : 110 - 112.

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