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Investigation on the strain of SiGe/Si heteroepitaxial system during high temperature annealing byBiBS/Channeling

Investigation on the strain of SiGe/Si heteroepitaxial system during high temperature annealing by BiBS/Channeling
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摘要 The influence of the high temperature processing on the strain stored in SiGe hetero-epilayer was studied by means of RBS/Channeling. Channeling angular scan along the ,< 110> axial direction in the (100) plane was used to characterize the tetragonal distortion in the SiGe strained layer. The strained crystal structure parameters were acquired by combining the determination of strain with the elasticity theory. It is shown that the strain stored in the SiGe epilayer has significantly change (relaxation factor from 0.023 to 0.84) after high temperature annealing. The potential strain relaxation mechanisms were discussed. The influence of the high temperature processing on the strain stored in SiGe hetero-epilayer was studied by means of RBS/Channeling. Channeling angular scan along the ,< 110> axial direction in the (100) plane was used to characterize the tetragonal distortion in the SiGe strained layer. The strained crystal structure parameters were acquired by combining the determination of strain with the elasticity theory. It is shown that the strain stored in the SiGe epilayer has significantly change (relaxation factor from 0.023 to 0.84) after high temperature annealing. The potential strain relaxation mechanisms were discussed.
出处 《Nuclear Science and Techniques》 SCIE CAS CSCD 2001年第4期295-301,共7页 核技术(英文)
基金 Supported by the National Natural Sciences Foundation of China (10075072)
关键词 合金薄膜 高温退火 集成电路 Strain, SiGe epilayer, RBS/Channeling, High temperature anneals.
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参考文献18

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