摘要
研究了以氧化亚铜为基，添加以金属铜作为导电组元的金属陶瓷的制备工艺．随着压制压力的增加和烧结时间的延长，所制备材料的密度呈规律性地递增．合理的工艺参数为P≥300MPa，t=10h至20h．烧结粉末体中含w（Cu）达30％时，其密实化过程及动力学曲线与粉末材料的已知规律拟合得非常好．
The paper deals with the processing of metal ceramic sintered by adding Cu into the mattrix. The density of material processed increases with the increase of preasuee(P) and sintering time (t). The rationale technological parameters are: P≥MPa, τ=10～20h. When the content of reddid Cu reach 30Wt% in the sintering powder, the process of densification and the kinetics curves coincide quite well with sintering the powder material.
出处
《材料科学与工艺》
EI
CAS
CSCD
1999年第1期38-42,47,共6页
Materials Science and Technology
