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高频高速覆铜板介电性能项目的测试技术发展综述(上)——高频介电常数测试技术现状分析 被引量:3

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摘要 在印制电路板的制造过程中,介电常数是影响板材性能的重要参数,因此选择合适的介电常数测量技术显得尤为重要。本文系统地介绍了目前业界广泛使用的高频介电常数测量方法的现状,并分析其优势和不足,以及毫米波测试技术的发展趋势。
作者 葛鹰 朱泳名
出处 《覆铜板资讯》 2019年第3期36-44,12,共10页 Copper Clad Laminate Information
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