高功率半导体巴条激光器的热特性分析

Thermal Analysis of High Power Semiconductor Laser Bar

对采用5层叠焊的微通道无氧铜热沉冷却的巴条激光器进行了流体动力学(CFD)分析。建立了条宽10 mm、腔长1.5 mm巴条芯片的流固耦合共轭传热模型,得到了不同流量水冷下激光器的热阻和压力损失曲线。分析了300 m L/min水流时,激光器的温度分布和冷却水的流动性能。实验条件下,测试了该微通道热沉封装的808 nm巴条激光器的热阻和压力损失。数值计算和实验测试所得的结果一致,在300 m L/min水流下,巴条热阻为0.38℃/W,在温度不高于70℃时可满足连续模式下90 W的散热要求。

Computational fluid dynamics( CFD) simulation and experimental analysis are presented for a semiconductor laser bar,which is cooled by a 5-layer oxygen-free copper micro-channel heat sink. A fluid-solid coupling conjugate heat transfer model is built for the micro-channel cooler and10 mm-wide,1. 5 mm-cavities long bar. The curves of thermal resistance and pressure drop to flowing rate are plotted. The temperature of the laser bar and the characteristic of the cooling water are studied at 300 m L / min flowing rate. An experimental testing is performed for the thermal resistance and pressure drop of an 808 nm laser,which is packaged with the micro-channel cooler. The simulation results consistent with experiment. In the flowing rate of 300 m L / min,the thermal resistance is 0. 38 ℃ / W,which can dissipate a continuous 90 W heat below 70 ℃.