金属铜表面镀锡的动力学过程

Dynamic Process of Plating Tin on Copper Surface

使用SL200ABD型接触角仪在室温条件下,研究在不同浓度和不同温度下氯化亚锡溶液在金属铜表面的润湿性及铺展动力学研究,结果表明,氯化亚锡溶液浓度介于15g/L-20g/L时,氯化亚锡溶液和金属铜表面反应的初态接触角最大,终态接触角最小。升高氯化亚锡溶液和金属铜体系发生反应的温度,能缩短其反应达到平衡状态的时间,温度对体系的影响较大。

The wettability and spreading kinetics of stannous chloride solution on copper metal surface at different concentrations and different temperatures were studied by using SL200 ABD contact angle meter at room temperature. The results show that the concentration of stannous chloride solution At 15 g/L-20 g/L, the initial contact angle of the stannous chloride solution and the metallic copper surface is the largest, and the contact angle of the final contact state is the smallest. Increasing the temperature of the reaction between the stannous chloride solution and the metallic copper system can shorten the time for the reaction to reach the equilibrium state, and the temperature greatly affects the system.