电解式测厚仪锌基镀铜厚度标准片制备

Preparation of Electroplated Copper Coatings on Znic Substrate Standard Plate for Coulometric Coating Thickness Tester

为解决电解测厚仪锌基镀铜标准片的镀层结合力和溯源性差的问题,采用预浸活化碱性镀铜工艺取代氰化物镀铜工艺,解决了环保和标准片镀层结合力相矛盾的问题;应用自主设计的电解池,在锌基上获得厚度均匀、不完全包覆的镀铜层,满足了电解测厚仪锌基镀铜标准片的要求。

To solve the problems of the electroplating coat adhesion and traceability of electroplated copper coating on Zinc substrate standard film for coulometric coating thickness tester,the process of preimpregnation activation alkaline copper plating is applied to substitute for the process of cyanide copper plating.This substitution can solve the contradiction between environment protection and plating coat adhesion of standard film.An independently designed electroplating cell is used to obtain copper plating with incompletely coated cast and uniform thickness, meeting the requirements of copper coating on zinc substrate standard film for coulometric coating thickness tester.