高速光亮镀金

Bright Gold Plating at Higher Speed

讨论新型高速光亮镀金溶液的配方以及操作条件的变化对金镀层的孔隙率,阴极电流效率,镀层外观的影响。由于该镀液能在高电流密度下操作,因而在电子工业中可用于印制电路板插头及其簧片的自动镀金和高速滚镀金系统。

This paper discusses the formular of a new type of gold plating bath at higher speed as well as the effect of variation of the operating conditions on the porosity, cathodic efficiency and the appearance.As the bath allows the operation at higher current densities,it can be used for the automatic gold plating or rolling gold plating system for the plugs or the edge tabs of printed circuit board.