摘要
针对温变环境下封装器件受热膨胀引起器件产生应力变形,造成器件可靠性下降甚至失效的问题,本文研究了板级电路在温度交变环境下的响应特性。首先,建立了含有带引脚四方扁平封装(QFP)和小外形封装(SOP)的电路板,并采用Workbench软件对模型进行了温度场分析和结构场分析,得到了电路板模型各时刻的温度场分布、最终时刻的变形和应力应变情况,并且基于Coffin-Manson方程计算出电路板的疲劳寿命。这些工作为探究实际热载荷对电路板可靠性的影响,优化电路板的工作环境具有指导意义。
In order to analyze the mechanical response characteristics of PCB under thermo-mechanical coupling environment, the working state of PCB is susceptible to the influence of thermo-mechanical coupling environment. Firstly, circuit boards with pin-and-pin quadrilateral flat package(QFP) and small shape package(SOP) were built, and the temperature field and structure field of the model were analyzed by Workbench software. The distribution of temperature field at each time, the deformation and stress-strain at the final time of the circuit board model are obtained, and the fatigue life of the circuit board is calculated based on the Caoffin-Manson equation. In order to explore the effect of actual thermal load on the reliability of circuit board, it is instructive to optimize the working environment of circuit board.
作者
李政
史兴华
王海东
蒋刚
LI Zheng;SHI Xing-hua;WANG Hai-dong;JIANG Gang(College of Mechanical and Electrical Engineering,Xi’an University of Electronic Science and Technology,Xi’an Shaanxi 710071,China;Environmental Test and Inspection Department,Shanghai Institute of Aerospace Precision Machinery,Shanghai 201600,China)
出处
《装备制造技术》
2019年第6期50-54,共5页
Equipment Manufacturing Technology
基金
装备预先研究项目(41402010401)
中央高校基本科研业务费专项资金资助(XJS18046)
关键词
热力耦合
四方扁平封装
小外形封装
疲劳寿命
thermal-mechanical coupling
square flat package
small shape package
fatigue life
