化学镀镍的电化学原理与实现低温快速化学镀镍的方法

Electrochemical mechanism of electroless nickel plating and methods of realizing rapid electroless nickel plating at low temperature

介绍了化学镀镍的电化学基本原理,概述了分别采用次磷酸钠、硼氢化钠、二甲基胺硼烷和水合肼作为还原剂时化学镀镍的主要特性。综述了加速低温化学镀镍的研究进展,提出增强化学镀镍反应系统的内在驱动力和外部推动力的方法,展望了低温快速化学镀镍工艺未来的研究方向。

The basic electrochemical mechanism of electroless nickel plating was introduced.The main properties of electroless nickel plating with sodium hypophosphite,sodium borohydride,dimethylamine borane,and hydrazine hydrate as reductant respectively were summarized.The research progress of accelerating electroless nickel plating at low temperature was reviewed.The methods of increasing the internal and external driving force of electroless nickel plating reaction system were given.The future research directions of rapid and low-temperature electroless nickel plating technology were proposed.