金属表面等离子体增强半导体纳米材料光催化机理研究进展

Review on the Mechanism of Metal Surface Plasmon Resonance Enhanced Photocatalysis of Semiconductor Nanomaterials

表面等离子体增强光催化纳米技术近年来引起了人们的极大关注,许多研究者开展了相关研究,在物理、化学、材料等多个领域均取得了重要进展。文章综述了近年来以贵金属为代表的等离子体共振纳米颗粒对半导体材料的光催化增强机理等的研究,包括肖特基势垒、热电子注入、能量共振传递等方面的一些最新进展。针对Ag、Au以及Bi等金属的增强光催化机制进行了分析与归纳,总结了在金属/半导体界面由于等离子体共振引起的材料性能增强的一般规律。此外,还对含贵金属的多元半导体系统的一些最新进展进行了介绍。总的来说,金属增强光催化领域研究已成为当前材料研究与设计领域的一个热点,在有机物氧化/还原、重金属还原、光催化分解水制氢以及CO2光催化等多个关系人类社会发展的重要领域均有重要的作用。

The metal surface plasmon enhanced photocatalysis has recently aroused great concern.Many researchers have devoted in the related research and achieved great progress in physics,chemistry and materials,etc.This paper reviewed the recent research on the surface plasmon enhanced photocatalysis,including the effects of Schottky barrier,hot electrons injection and energy resonance processes.The effect of Ag,Au and Bi metal on enhancing the photocatalysis has been analyzed,and the common mechanism of the surface plasmon resonance energy transfer at the interface between the metal and semiconductor were summarized.The recent development of noble metal on the photocatalysis of multiple-component semiconductors is also reviewed.In conclusion,the metal enhanced photocatalysis has been a hot field in the research of material fabrication and design,which plays important role in human and society development such also organic oxidation/reduction,heavy metal reduction,hydrogen production from water and carbon dioxide photocatalysis.