大面积芯片/DBC基板自蔓延互连热应力场研究

Study on Thermal Stress Field of Self-propagating Interconnection of Large Area Chip/DBC Substrate

与传统整体加热的大面积芯片/DBC基板焊料互连方法相比,使用自蔓延薄膜为局部热源的焊料互连方法有加热迅速、热影响区小和热量集中等特点。主要采用有限元模拟的方法,对大面积芯片/DBC基板自蔓延互连过程中的热应力场进行分析,得到了不同时刻互连结构的翘曲变化,研究了压力对互连结构残余应力的影响规律。

Compared with the traditional solder interconnection method for large area chip/DBC substrate,the solder interconnection method using self-propagating film as local heat source has the characteristics of rapid heating,small heat affected zone and concentrated heat.The finite element method is used to simulate and analyze the thermal stress field of the large-area chip/DBC substrate during the self-propagating interconnection process.The warpage of the interconnected structures at different stages was obtained,and the influence of pressure on the residual stress of the interconnected structures was studied.