摘要
分析了聚氨酯树脂漆层对BGA器件热风返修过程的影响,重点讨论了返修过程中隔热防护措施的设计及新返修流程的设计。通过温度曲线验证了隔热防护措施的有效性,按照新返修流程制作的样件,符合检验标准且通过了实验验证。本研究有效解决了此类器件的可靠返修问题。
The influence of polyurethane resin coating on BGA devices in hot-air repair process was analyzed.The design of thermal insulation protection measures and the design of new rework process were emphatically discussed.The effectiveness of thermal insulation protection measures is verified by the temperature curve.The samples made according to the new repairing process meet the inspection standards and pass the experimental verification.This study effectively solves the problem of reliable repairs of such devices.
作者
赵丙款
唐杰
田冬冬
ZHAO Bingkuan;TANG Jie;TIAN Dongdong(AVIC LeiHua Electronic Technology Research Institute,Wuxi 214126,China)
出处
《电子工艺技术》
2019年第4期224-226,248,共4页
Electronics Process Technology
