摘要
微波组件的失效与所承受的外界应力紧密相关,通过采用设计改进措施降低薄弱部位承受外界应力的影响,提高产品的可靠性,通过对某型微波组件在密封试验中结构件变形失效的案例分析,提出了采用盖板加固措施,通过了GJB360B方法112条件C试验验证,满足了微波组件在整机上的使用要求,防止在压力环境中盖板变形造成开裂及产品失效。
The failure of microwave modules is closely related with the external stess.The reliability of the produ-cts can be increased through improving the design as well as reducing the external stress effect on the weak parts.Some measures of strengthens cover plate are presented in this paper by analyzing the case of deforma-tion of cover plate of a certain type of microwave module during the sealing test experiment.These measures are verified by the GJB360B method 112 condition C test,the results show that the microwave modules can meet the application requirements in the whole systems.
作者
费静
Fei Jing(Chengdu Taige Microelectronics Research Institute Co.,Ltd,Sichuan Chengdu 610000)
出处
《电子质量》
2019年第8期30-32,共3页
Electronics Quality
关键词
微波组件
密封
细检漏
外界应力
控制措施
microwave modules
sealing
fine leak
external stress
control measure
