摘要
在手机摄像模组生产过程中,芯片粘接质量的好坏直接关系到产品的良率。COB封装技术因其优良特性而被广泛应用在手机摄像模组生产过程中。针对手机摄像模组采用COB封装工艺时,芯片与电路板之间采用胶水贴装,分析了胶水的画胶方案对芯片与电路板粘接面积的影响。首先利用流固耦合的仿真分析对6种常见的DA胶画胶方案进行初步筛选。再通过实验进一步从生产效率、SAT扫描、胶面积大小以及场曲等几个方面结合实际制程对画胶方案进行对比,最终选取最合适的画胶方案。
In the production of mobile phone camera module,the chip bonding quality is directly related to the yield of the product.COB packaging technology is widely used for its excellent characteristics.In this paper,the effect of the glue drawing design on the bonding area between the chip and the circuit board is analyzed.First of all,six common DA glue painting designs are preliminarily screened through the simulation analysis of fluid-solid coupling.Then through the experiment,we further compared the glue painting schemes from the aspects of production efficiency,scanning acoustic microscope,glue area size and field curve,etc.combined with the actual production process,and selected the most suitable glue painting design.
作者
王明珠
姚立锋
赵波杰
李凤云
蒋恒
WANG Mingzhu;YAO Lifeng;ZHAO Bojie;LI Fengyun;JIANG Heng(R&d Center,Ningbo Sunny Opotech Co.,Ltd.,Ningbo 315400,China)
出处
《电子与封装》
2019年第9期15-18,23,共5页
Electronics & Packaging
关键词
COB封装
DA胶
手机摄像模组
仿真
胶线设计
COB package
DA glue
mobile phone camera module
simulation
painting design
