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三氧化二铝对环氧树脂固化动力学及热降解动力学的影响 被引量:2

Effects of Aluminum Oxide on Curing and Thermal Decomposition Kinetics of Epoxy Resin
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摘要 采用热分析法研究了高含量Al2O3填料对环氧树脂(E51)/二氨基二苯甲烷(DDM)体系的固化表观活化能、热降解动力学和性能的影响.非等温差式扫描量热法(DSC)固化动力学研究表明,加入Al2O3体系的反应活化能由51.49 kJ/mol降低至48.12 kJ/mol;用n级非等温动力学法分析获得了固化反应的动力学参数.利用热重分析研究了环氧固化物体系的热降解动力学,用FWO方法计算固化物降解活化能结果表明,Al2O3粉体对E51/DDM体系初始分解活化能影响不大,当降解率达到30%时,Al2O3粉体对E51/DDM体系分解有明显的抑制作用.热重红外联用测试结果表明,甲烷、羰基化合物、胺和双酚A是E51/DDM热分解过程中的主要产物,Al2O3粉体能提高E51/DDM体系的热稳定性.动态热机械研究表明,Al2O3的加入增大了环氧树脂固化产物的储能模量.DSC测试结果表明,Al2O3加入后,体系的玻璃化转变温度由114.16℃提高到121.51℃. The effects of high content Al2O3 particles on the apparent activation energy,thermal decomposition kinetics and properties of epoxy resin(E51)/4,4'-Diaminodiphenylmet(DDM)system were investigated by a thermal analysis.The results on the curing kinetics of non-isothermal differential scanning calorimetry(DSC)showed that the addition of Al2O3 promoted the curing reaction.The activation energy of the E44/DDM system was reduced from 51.49 kJ/mol to 48.12 kJ/mol after 80%Al2O3 addition.In addition,the kinetic parameters of the curing reaction were obtained by the n order model.Thermo-gravimetric analyzer was used to study the thermal decomposition kinetics of the epoxy curing system.The FWO method was used to calculate the activation energy of the degradation.The results showed that the addition of Al2O3 powder had little effect on the initial decomposition activation energy of the 80%E51/DDM system.When the degradation rate reached 30%,the Al2O3 powder had obvious inhibitory effect on the decomposition of E51/DDM system.The results of TG-IR test showed that carbon oxides,methane,carbonyl compounds,amines and aromatic compounds are the main products in the process of E51/DDM thermal decomposition.Al2O3 powder can improve the thermal stability of the E51/DDM system.Dynamic mechanics showed that the addition of Al2O3 increased the modulus of storage of epoxy resin cured products.DSC results showed that the addition of Al2O3 powder increases the glass transition temperature from 114.16℃to 121.51℃of the system.
作者 张英明 王兵毅 余坚 郝志峰 柯勇 陈毅龙 Zhang Ying-ming;Wang Bing-yi;Yu Jian;Hao Zhi-feng;Ke Yong;Chen Yi-long(School of Chemical Engineering and Light Industry,Guangdong University of Technology,Guangzhou 510006,China;Kinwong Electronic Technology(Longchuan)Co.,Ltd,Heyuan 517300,China)
出处 《广东工业大学学报》 CAS 2019年第5期63-70,共8页 Journal of Guangdong University of Technology
基金 广东省应用型科技研发专项资金项目(2016B090930004)
关键词 环氧树脂 三氧化二铝 固化动力学 热降解动力学 epoxy resin Al_(2)O_(3) curing kinetics thermal degradation kinetics
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  • 1梁宪珠,孙占红,张铖,刘天舒.航空预浸料—热压罐工艺复合材料技术应用概况[J].航空制造技术,2011,0(20):26-30. 被引量:14
  • 2许兆棠,朱如鹏.直升机复合材料传动轴的主共振分析[J].机械工程学报,2006,42(2):155-160. 被引量:10
  • 3赵卫娟,张佐光,孙志杰,张大兴.非等温法研究TGDDM/DDS体系固化反应动力学[J].高分子学报,2006,16(4):564-568. 被引量:47
  • 4Rosu D, Mustata F, Cascaval C N. Investigation of the curing reactions of some multifunctional epoxy resin using differential calorimetry[J]. Therrnochimica Acta, 2001, 370: 105-110.
  • 5Buggy M, Teminhan T, Braddell O. Curing of carbon fiber reinforced epoxy matrix composites [J ]. J. Mater. Process. Technol., 1996, 56: 292-301.
  • 6Moon-Kwang U, Daniel I M, Hwang B S. A study of cure kinetics by the use of dynamic differential scanning calorimetry[J]. Compos. Sci. Teehnol., 2002, 62: 29-40.
  • 7Yousefi A, Lafleur P G. Kinetic studies of theft cure reactions:a review[J]. Polym. Compos., 1997, 18(2):157-167.
  • 8胡祖荣,高胜利,赵凤起,等.热分析动力学[M].2nd ed.北京:科学出版社,2001:79-131.
  • 9Rosu D, Cascaval C N, Mustata F, et al. Cure kinetics of epoxy resin studied by non-isothermal IXSC data[J]. Thermochimica A_cta, 2002, 383: 119-127.
  • 10Ivankovic M, Incarnato L, Kermy J M, et al. Curing kinetics and chemorheology of epoxy/anhydride system[J]. J. Appl. Polym. Sci., 2003, 90. 3012-3019.

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