摘要
气相清洗技术应用于军用厚膜电路组装、裸芯片基板微组装等工艺流程,既可以清除污垢,提高印刷电路板各组件的可靠性和寿命,又可以暴露热损伤等缺陷,提高产品质量检验的准确性。设计了气相清洗机系统,并对其工作原理、组成、热力学计算、电气控制等方面进行了详细的说明。
Gas phase cleaning technology is applied to military thick film circuit assembly,bare chip substrate micro assembly and other processes.This technology can remove dirt and improve the reliability and life of various components of printed circuit boards,and can expose defects such as thermal damage to improve the accuracy of product quality inspection.The gas phase cleaning machine system was designed,and its working principle,composition,thermodynamic calculation and electrical control were described in detail.
作者
冯欣宇
胡钱旺
俞杰
FENG Xin-yu;HU Qian-wang;YU Jie(Anhui Vacree Technologies Co.,Ltd.,Hefei 230088,China;The 16th Research Institute of China Electronics Technology Group Corporation,Hefei 230088,China)
出处
《机械工程与自动化》
2019年第5期139-140,共2页
Mechanical Engineering & Automation
关键词
气相清洗机
热力学计算
工作原理
gas phase cleaning machine
thermodynamic calculation
working principle