硅对铜/铝硅合金轧制复合板界面组织与结合性能的影响

Effect of silicon on interfacial microstructure and bond property of Cu/Al-Si alloy clad sheet produced by roll bonding

采用不同硅含量的铝硅合金板与铜板进行轧制复合,研究退火后复合板的界面组织与性能。利用光学显微镜观察界面显微组织,通过剥离实验研究界面结合性能。结果表明,退火时硅会在界面形成偏聚并阻碍扩散;较高的硅含量会降低界面结合强度,使双金属的变形过程更趋于同步。

Copper and aluminum-silicon alloy sheets with different silicon contents were applied to roll bonding process.The interfacial microstructure and properties of clad sheet after annealing were investigated.The interfacial microstructure was observed by optical microscope.The interfacial bond property was studied by peeling tests.The results indicate that silicon can gather on interface and hinder diffusion.High silicon content lowers interfacial bond strength and makes the deformation process of two metal layers tend to be uniform.