期刊文献+

轮转调度通用实时热电偶测温序列设计 被引量:12

Design of Universal Real-time Thermocouple Thermometry Sequence for Rotation Scheduling
下载PDF
导出
摘要 为增加热电偶测温点数,保证测温的实时性,基于剥夺式内核UCOSIII操作系统和STM32F4单片机,设计实现了时间片轮转调度实时热电偶测温序列。测温序列共20个测温点,采用MAX6675芯片实现对K型热电偶的A/D转换与冷端补偿,测温序列共用一组SPI总线,通过互斥信号量实现测温任务间切换。基于STemWin设计制作了人机交互界面,通过触摸按钮实现测温任务的创建、恢复与挂起,通过LCD提供人机交互渠道,定义任务标志寄存器TEMS_FLAG实时记录测温任务的运行状态。实验证明,系统的运行稳定,操作简便,可应用在工业测温现场。 To increase the number of thermocouple temperature points,and guarantee the real-time performance,a real-time thermocouple temperature measurement sequence for time slice rotation scheduling was designed and implemented based on the deprivation kernel UCOSIII operating system and STM32F4 microcontroller.The sequence had 20 measurement points,using the MAX6675 chip to realize AD conversion and cold junction compensation for K type thermocouple,and the measurement sequences shared a group of SPI buses,the measurement tasks switched between tasks with a mutex semaphore.A interactive interface was designed and manufactured based on STemWin,and the system created,restored,and suspended tasks with the touch of buttons,as well as provided interaction channels through LCD,and defined the task flag register TEMS_FLAG to record the running status of measurement task.According to the experiments,the system is stable,easy to operate,and can be used in industrial temperature measurement.
作者 王子权 周小超 林华 WANG Zi-quan;ZHOU Xiao-chao;LIN Hua(School of Mechanical Engineering,Hefei University of Technology,Hefei 230009,China)
出处 《仪表技术与传感器》 CSCD 北大核心 2019年第9期23-27,共5页 Instrument Technique and Sensor
关键词 热电偶 UCOSIII STM32 MAX6675 STemWin thermocouple UCOSIII STM32 MAX6675 STemWin
  • 相关文献

参考文献8

二级参考文献65

  • 1李宁,秦树人,吴莹.多线程VC++和Matlab混编在信号采集和处理中的应用[J].中国测试技术,2006,32(3):82-85. 被引量:4
  • 2黎振华,刘美红,蒋业华,周荣锋,周荣.多通道计算机温度采集系统的研究及应用[J].昆明理工大学学报(理工版),2006,31(5):44-47. 被引量:3
  • 3秦娟,郝弗非,孙晓薇,郝庭柱,郎培,沈花玉.多路温度检测自动控制系统的设计实现[J].天津理工大学学报,2007,23(2):51-53. 被引量:4
  • 4徐科军.传感器与检测技术[M].第7版.北京:电子工业出版社,2007:183-192.
  • 5纪友芳,李大海,林美娜.智能温度控制仪的设计与实现[J].计算机工程与设计,2007,28(17):4200-4202. 被引量:4
  • 6贾新章.OrCAD/PSpice9实用教程[M].西安:西安电子科技大学出版社,2010.
  • 7Jian X,Xu H, Meek T T, et al. Effect of power ultrasound onsolidification of aluminum A356 alloy [J]. Materials Letters,2005,59(2/3):190-193.
  • 8Khan S, Elliott R. Quench modification of aluminum siliconeutectic alloys [J] . Journal of Materials and Science,1996,31(14):3731-3737.
  • 9Hosch T, England L, Napolitano R. Analysis of the highgrowth-rate transition in Al-Si eutectic solidification[J]. Journal ofMaterials Science, 2009,44(18): 4892-4899.
  • 10Qin Shuren,Integrated testing technology and virtual instrument[J]. JournalofChongqingUniversity,2002,(4): 6-10.

共引文献77

同被引文献73

引证文献12

二级引证文献30

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部