微尺寸LED阵列芯片封装及其性能的研究

Study on Package and Performance of Micro-LED Array Devices

提出了一种针对微尺寸LED阵列芯片的集成封装方法,设计封装了6种发光单元尺寸不一的4×4微尺寸LED阵列芯片,色温控制在6 300 K左右,显色指数约为70。光电性能测试结果表明,发光单元越小,调制带宽越高。发光单元直径为60μm的芯片在90 mA的注入电流下,调制带宽达到了125.71 MHz,而发光单元尺寸越大,饱和光通量越高,直径为160μm的饱和光通量约为15 lm。这些结果将有助于制备可见光通信的白光光源,在保证照明品质的前提下提高调制频率。

A COB packaging method for the micro-LED array chips is proposed in the paper. Six kinds of 4×4 micro-LED arrays LED chips with different sizes of luminous units are designed and encapsulated. Its color temperature is controlled at about 6 300 K and the color rendering index is about 70. The photoelectric performance test results show that the smaller the luminous unit of micro-LED arrays is,the higher the modulation bandwidth is. At the injection current of 90 mA,the modulation bandwidth of the arrays chip with the diameter of 60 μm is up to 125.71 MHz. The results also show that the larger the luminous size is,the higher the saturation flux is,and the saturated flux is about 15 lm with a diameter of 160μm. These results will help to prepare the white LED sources for visible light communication,and improve the modulation bandwidth under the premise of ensuing the illumination quality.