摘要
光敏微晶玻璃是一种新型TGVs(Through Glass Vias,玻璃通孔)转接板基板材料,介电性能的改善有助于光敏微晶玻璃在集成电路应用中的发展。实验通过熔融法制备出不同Al2O3含量的光敏微晶玻璃,并借助网络矢量分析仪、红外光谱、拉曼光谱等手段研究样品的介电常数、介电损耗以及玻璃网络结构。其中Al2O3含量为2wt%的样品具有最优的介电常数和介电损耗,分别为5.0和4.8×10^-3(1 GHz)。
Photosensitive glass-ceramics is served as a new type of TGVs(Through Glass Vias)substrate material.The improvement of dielectric properties is helpful to the development of the applications of photosensitive glass-ceramics in integrated circuits.Photosensitive glass-ceramics with different Al2O3 contents were prepared by melting method in the experiment.The dielectric constant,dielectric loss and the glass network structure were studied by means of network vector analyzer,infrared spectrum and Raman spectrum.WhenAl2O3 content was 2wt%,the optimal dielectric constant and dielectric loss of 5.0 and 4.8×10^-3(1 GHz)were obtained,respectively.
作者
张浩
朱永昌
崔竹
韩勖
耿安东
ZHANG Hao;ZHU Yong-chang;CUI Zhu;HAN Xu;GENG An-dong(China Building Materials Academy,Beijing 100024,China;School of Materials Science and Engineering,Southwest University of Science and Technology,Mianyang 621000,China)
出处
《硅酸盐通报》
CAS
北大核心
2019年第9期2871-2875,共5页
Bulletin of the Chinese Ceramic Society
关键词
光敏微晶玻璃
介电常数
介电损耗
TGVs
photosensitive glass-ceramic
dielectric constant
dielectric loss
TGVs