β-锂霞石对Bi2O3-B2O3-ZnO系封接焊料封接粘结拉伸强度影响的研究

Tensile Bonding Strength of Bi2O3-B2O3-ZnO System Sealing Solder from β-Eucryptite

低温封接真空玻璃以降低退钢化效应是当前研究的难点问题,采用环保型封接焊料替代含铅焊料是热点问题,铋锌硼玻璃是最有希望替代含铅焊料的低熔点玻璃系统。将不同掺量(wt%)的β-锂霞石掺入到Bi2O3-B 2O 3-ZnO系封接玻璃中,制备封接焊料,通过十字交叉法测试在不同烧结温度下封接的封接粘结拉伸强度,研究β-锂霞石掺量、烧结温度对封接粘结拉伸强度、粘结层厚度的影响。结果表明:在410~430℃,β-锂霞石掺量为9%~12%时能明显提高封接粘结拉伸强度,其中410℃烧结时,掺量为9%的强度提高28%,达到1.19 MPa。β-锂霞石掺量6%~12%时,在410~450℃烧结温度范围,封接粘结拉伸强度随烧结温度变化小,有利于封接工艺的控制。随β-锂霞石掺量增加,封接界面处由明显的压应力转变为明显的拉应力,相应的封接粘结拉伸强度由低转变为高,再转变为低。在各烧结温度下粘结层厚度随β-锂霞石掺量的增加而增大,但未发现其与强度存在直接关联关系。

To seal vacuum glazing at low temperature to reduce detoughening effect is a difficult issue in current research;and to replace lead-containing sealing solder with environment-friendly solder is a hot issue.Bi2O3-B 2O 3-ZnO glass system was believed as the most promising glass to replace lead-bearing glass for its lower melting point.Different amount ofβ-eucryptite was mixed into Bi2O3-B2O3-ZnO sealing glass to make into solder;so,the effects of β-eucryptite amount and sintering temperature on tensile bonding strength and thickness of bonding layer was investigated by cross bonding method by sintering at different temperatures.The results show that the tensile bonding strength of 9%-12% β-eucryptite is significantly increase at 410℃ and 430℃,and the strength of 9% β-eucryptite is increased by 28%to 1.19 MPa at 410℃.The tensile bonding strength of β-eucryptite amount by 6% and 12% changes little with the sintering temperature from 410℃ to 450℃,indicating a advantageous control behavior for sealing processing.With the increase of β-eucryptite amount,the interface stress of samples changes from larger compressive stress to larger tensile stress,accordingly the tensile bonding strength varies from lower to larger and then to lower.The results also show sealing layer thickness increases with the increase ofβ-eucryptite content at different sintering temperatures,but no correlation is found between the bond thickness and the strength.