微流控芯片微通道复制度的表征及在注塑成型中的应用

Characterization of micro-channel replication in microfluidic chip and its application in injection molding

为提高注塑成型微流控芯片的微通道复制度,提出以微通道轮廓深度均方根差表征微通道复制度的方法,并利用该方法研究模具温度等工艺参数对芯片纵向及横向微通道复制度的影响。研究结果表明:纵向微通道复制度受模具温度和熔体温度的影响显著,当模具温度从80℃升至100℃时,近浇口端C处微通道轮廓深度均方根差降低18.96%;横向微通道复制度受保压时间影响最大,受注射速度和保压压力影响次之,保压时间为5 s时横向微通道A处微通道轮廓深度均方根差比保压时间为1 s时降低31.14%;同一芯片不同位置之间微通道复制度差异较大,横向微通道复制度普遍较低,纵向微通道与横向微通道轮廓深度均方根差最大差值达到4.07μm。

In order to improve the micro-channel replication of injection molded microfluidic chips,a new method was proposed to characterize the micro-channel replication based on the root mean square error(RMSE)of microchannel profile depth,and the effects of mold temperature and other process parameters on the longitudinal and transverse micro-channel replication were studied.The results show that the replication of the longitudinal microchannel is significantly affected by mold temperature and melt temperature,and the RMSE of miro-channel profile depth of point C nearing the gate is reduced by 18.96%when mold temperature increases from 80℃to 100℃.The holding time has the greatest effect on the replication of transverse micro-channel,and the effect of the injection rate and the holding pressure on the contour precision are smaller.The RMSE of the transverse microchannel profile depth of point A is reduced by 31.14%when the holding time increases from 1 s to 5 s.There is great difference in micro-channel replication between different locations.The contour precision of transverse micro-channel profile depth is generally lower than that of longitudinal micro-channel and the maximum RMSE is 4.07μm.