双层双联微模块设计方案

Research on design scheme of double-layer and double-connected micro-module

随着5G时代的到来及物联网、云计算、AI等新兴技术的迅速发展,数据业务形成了大容量、大带宽、大连接和低时延等新特征,这就要求数据中心能够实现大规模、快速灵活部署和弹性扩展。传统数据中心建设模式面临的主要问题是建设周期长,土建建设与业务需求不匹配,业务部署灵活性和扩展性不佳。基于上述矛盾,具备装配化和模块化特征的微型模块化数据中心解决方案应运而生。本文以双层双联微模块方案研究为例,总结分享新技术研究历程,为后续产品化设计提供借鉴。

With the advent of 5G era and the rapid development of Internet of things,cloud computing,AI and other emerging technologies,data services have formed new features such as large capacity,large bandwidth,big connection and low latency.This requires data centers to achieve large-scale,rapid and flexible deployment and flexible expansion.The main problems faced by the traditional data center are as follows:construction cycle during a long;civil construction and business needs do not match;business deployment flexibility,scalability is not good.Based on the above contradictions,the application of micro-modular data center solutions with the characteristics of assembly and modularization came into being.This paper takes the research of double-layer and double-connected micro-module as an example,summarizes and shares the research process of new technology,and provides a reference for the followup product design.