轻量化层叠式电子设备的振动分析

Vibration analysis for lightweight and laminated electronic equipment

航天电子产品在发射段要经历严酷的力学环境考核;为实现电路板动力学响应结果的准确预测,对影响响应结果的各参数进行了分析。首先,对电路板建模的等效方法进行了分析探讨,明确了“全局均分”的建模方式;其次,根据电路板的动力学响应方程,结合大量试验数据,对影响“全局均分法”分析结果的2个因素进行了统计分析,确定了各因素的合理取值范围;最后,利用“全局均分”的建模方法对某视频箱进行了动力学分析,并与试验结果进行对比。结果表明,分析结果与试验数据的误差在18%以内,满足工程应用要求,能够快速实现电路板动力学响应结果的预测,对相关产品后续设计工作提供参考依据。

Aerospace electronic products have to experience harsh assessment of mechanical environment in launch period.Here,in order to accurately predict dynamic response results of printed circuit boards(PCBs),parameters affecting prediction results were analyzed.Firstly,the equivalence methods for PCB modeling were analyzed and explored to clarify the global mean modeling one.Secondly,according to the dynamic response equation of PCB,using a large amount of test data,statistical analyses were performed for two factors affecting the analysis results of the global mean method to determine the reasonable range of each factor.Finally,the global mean modeling method was used to do dynamic analysis for a video electronic box,and compare the analysis results with test data.Results showed that the error between analysis results and test data is within 18%to meet requirements of engineering application,the proposed method can rapidly realize the prediction of PCB dynamic responses;the proposed method provides a reference for the further design work of corresponding products.