均热板散热结构的设计研究

Design and Research of Heat Plate Heat Dissipation Structure

现今电子产品的发展方向逐渐走向高效能、小尺寸,轻薄高效的散热装置具有较大的市场前景。研究针对均热板进行结构改进,采用上板平行沟槽取代传统上板毛细结构来降低均热板厚度并提升均热板的热传极限。随后研究了均热板在不同受热面积和不同工作流体下的传热性能表现,并对比了传统均热板与新型均热板的传热性能。结果表明:受热面积越大,热传极限越高且热阻值越低;同时,因新型均热板采用上板平行沟槽设计,使得工作流体丙酮的热传极限较传统热管优异;另外,相同加热瓦数和热通量下的新型均热板热阻值均小于传统均热板,热稳定性良好;且该新型均热板的市场应用前景良好。

Nowadays,the development direction of electronic products gradually moves towards high-performance and small-size.The thin and efficient heat-dissipating device has a large market prospect.In this study,the structure of soaking plate was improved,and the upper plate capillary structure was replaced by the upper plate parallel groove in order to reduce the thickness of the heat-receiving plate and increase the heat transfer limit of the soaking plate.Then the heat transfer performance of the soaking plate under different heating areas and different working fluids was studied,and the heat transfer performance of the traditional soaking plate and the new soaking plate was compared.The results show that the larger the heat receiving area,the higher the heat transfer limit and the lower thermal resistance value was.At the same time,due to the parallel groove design of the upper plate of the new soaking plate,the heat transfer limit of the working fluid acetone was superior to that of the conventional heat pipe.In addition,under the same heating wattage and heat flux,the thermal resistance values of the new soaking plates was smaller than that of the traditional soaking plates.And the thermal stability of the new soaking plates was good.The market application prospect of the new soaking plates is broad.