某机载设备高热耗电源模块散热技术

Heat Dissipation Technology of High Heat Consuming Power Module of an Airborne Jamming Equipment

针对某机载设备的电源模块散热问题,采用蒸汽腔均温板进行热设计,借助仿真软件进行热分析,并对电源模块均温板进行模拟负载热测试及随整机开展高温试验,仿真及试验结果表明:均温板是一种强化传热的有效手段,能显著改善小空间高热耗芯片的传导散热条件、解决芯片的散热及均温性难题。

To solve the heat dissipation problem of power module of an airborne jamming equipment,the vapor chamber is used for thermal design,and thermal analysis is carried out by means of simulation software,the simulated thermal load test and the high temperature test with the complete machine are carried out on the vapor chamber of the power module. Simulation and test results show that the vapor chamber is a means of enhancing heat transfer,it can significantly improve the conduction and heat dissipation conditions of chips with small space and high heat consumption,and solve the problem of the chip heat dissipation and temperature uniformity.