摘要
转印技术是近年来兴起的一种确定性组装技术,主要用于将微纳米材料按照一定的功能要求组装成二维或者三维结构,从而制造出各种微纳米器件。首先对转印技术的工艺流程进行了介绍,接着对目前已报道的主要转印方法进行了分类,对每种方法转印的功能结构材料、转印时使用的图章材料、受主基片的材料、功能结构的特征尺寸等进行了归纳,然后介绍了转印技术在柔性电子中的几个典型应用,最后,列举了几点转印技术还有待解决的关键问题。
Transfer printing is an emerging deterministic assembly technique. According to required functions,transfer printing can assemble microand nanomaterials into two or three-dimensional structures to fabricate a variety of micro-and nanodevices. First,the process flow for transfer printing was introduced. Second, most of the reported transfer printing methods were classified, and for each method, the ink materials, the stamp materials, the receiver materials and the feature size of the ink were induced. Third, several typical applications of transfer printing in flexible electronics were introduced. Finally,a few challenges in transfer printing were put forward.
作者
庞博
胡小光
王泽龙
刘军山
PANG Bo;HU Xiaoguang;WANG Zelong;LIU Junshan(Key Laboratory for Micro/Nano Technology and System of Liaoning Province,Dalian University of Technology,Dalian116024,China)
出处
《机电工程技术》
2019年第10期145-149,共5页
Mechanical & Electrical Engineering Technology
基金
国家自然科学基金项目(编号:51875083,51621064)
关键词
转印技术
图章
功能结构
施主
受主
柔性电子
transfer printing
stamp
ink
donor
receiver
flexible electronics