双光子聚合加工均匀木堆结构方法的研究

Study on the Fabrication of Uniform Log-Pile Structure Via Two-Photon Polymerization

由于双光子聚合所具有的纳米级加工分辨率以及真三维制造能力,被广泛应用于微米纳米制造领域。利用双光子聚合加工的三维木堆结构是实现生物支架、光子晶体、超材料等功能器件的重要途径之一。但是加工结构在经过后处理之后产生的不均匀收缩成为获得高质量木堆结构的重要阻碍,严重时会导致失去其结构的功能性。为了实现木堆结构的均匀性加工,提出一种通过降低加工结构与基底附着力的方法,来实现均匀木堆结构的加工。此外,采用Ormocomp光敏材料以及双光子聚合加工技术,对基底高附着力和低附着力的木堆结构分别进行了加工。通过对加工所得木堆结构的各层尺寸的测量,验证了所提出方法的有效性。

Because of the nanoscale resolution and true three-dimensional manufacturing capability of two photon polymerization,it has been widely used in the field of micro-/nano-fabrication.Three dimensional log-pile structure fabricated by two-photon polymerization is one of the important approaches to realize the functional device of biological scaffolds,photonic crystals and metamaterials.However,the uneven shrinkage of the processed structure after processing becomes an important obstacle to obtain high quality log-pile structure,which can lead to the loss of its structural function.In order to realize the uniform processing of wood pile structure,a method of reducing the adhesion between the processing structure and the substrate is put forward to realize the processing of the homogeneous wood pile structure.In addition,Ormocomp photosensitive materials and two-photon polymerization processing technology based on high adhesion and low substrate adhesion of the log-pile structure were processed.The validity of the proposed method is verified by measuring the dimensions of the log-pile structures.