碳化硅高速磨削表面完整性研究

Surface Integrity of the High-Speed Grinding of Silicon Carbide

针对碳化硅的应用日益扩大,但它质地硬脆,高效率高质量加工总遇到障碍的情况,采用高速磨削工艺,研究了砂轮速度对磨削力和材料去除率的演变规律,开展了磨屑形态、磨削表面和亚表面形貌观察,及表面粗糙度、残余应力等一系列试验。结果表明:高速磨削能降低磨削力和磨削热,减小磨削损伤层,成比例提高砂轮速度和工件速度能增进表面完整性和提升加工效率。基于磨削层表面粗糙度和深度残余应力的检测,表明:在碳化硅高速磨削中,存在脆-延性去除机理的转化过程;高速磨削有望成为高效率高质量磨削工程陶瓷碳化硅的一条有效途径。

Although there are increasing applications of silicon carbide,its hard and brittle texture set an obstacle on high efficiency and good quality machining.Adopting high-speed grinding technology,this paper studied the evolution laws of grinding wheel speed to grinding force and material removal rate.A series of tests on debris morphology,grinding surface and subsurface topography,surface roughness and residual stress were carried out.The results show that the high speed grinding can reduce grinding force and heat,resulting a low grinding damage layer.Besides,proportional increasing the grinding wheel speed and the workpiece speed can improve the surface integrity and improve the machining efficiency.Based on the measurements of surface roughness and residual stress depth profile of grinding layer,the results show that there is a transformation process of brittle-ductile removal mechanism in high speed grinding of silicon carbide.High speed grinding is expected to be an effective way for high efficiency and high quality grinding of engineering ceramic silicon carbide.