铜颗粒填充型铜-聚苯醚复合导电胶制备及性能研究

Preparation and Properties of Cu-PPO Conductive Adhesive Filled with Copper Nanoparticle

该文采用粒径在50 nm^10μm之间不同规格的铜粉制备导电胶,对铜粉粒径大小、纳米铜粉添加量、聚苯醚与四氢呋喃质量比以及不同表面修饰方式等对导电胶电阻率及弯曲强度的影响进行了研究,并采用扫描电子显微镜(SEM)方法研究了复合材料的微观形貌。结果表明,通过控制铜粉与聚苯醚的比例,可制得不同电阻率和弯曲强度的导电胶。在铜粉与四氢呋喃溶液质量比为1∶6、聚苯醚与四氢呋喃质量比为1∶8. 9,40℃下固化时间为4 h时可使制备时间最短,材料性能较好。

In this paper,a conductive paste is prepared by using copper powder of different sizes between 50 nm and 10 μm.The effects of copper powder particle size,nano copper powder addition,mass ratio of polyphenylene ether to tetrahydrofuran and different surface modification methods on the electrical resistivity and flexural strength of conductive adhesives were investigated. The microstructure of the composites was investigated by scanning electron microscopy(SEM). The results show that by controlling the ratio of copper powder to polyphenylene ether,conductive adhesives with different resistivity and bending strength can be obtained. When the mass ratio of copper powder to tetrahydrofuran solution is 1∶6,the mass ratio of polyphenylene ether to tetrahydrofuran is 1∶8. 9,and the curing time is 4 h at 40 ℃,the preparation time is the shortest and the material performance is better.