低膨胀聚(酰胺-酰亚胺)薄膜的制备与性能研究

Preparation and Properties of Low Expansion Poly (amide-imide) Films

以2,2′-双(三氟甲基)-4,4′-二氨基联苯(TFMB)和氯化偏苯三酸酐(TMAc)为原料通过酰基化反应得到含三氟甲基酰胺型四羧酸二酐(TA-TFMB),再与4,4′-二氨基二苯醚(ODA)和TFMB两种二胺通过一步法共聚制备了一系列聚(酰胺-酰亚胺)(PAI)薄膜,并对薄膜进行动态热机械分析(DMA)、差示扫描量热分析(DSC)、热重分析(TGA)及光学性能测试。结果表明:PAI薄膜具有良好的热性能和光学性能,玻璃化转变温度为307.0~320.5℃,氮气氛围下,5%热分解温度为449.0~471.0℃;PAI-ODA的线性热膨胀系数(CTE)为17.63×10^-6/K,与普通铜箔的CTE(17.0×10^-6K)相一致;PAI-TFMB具有最高的透光率(85.43%),PAI薄膜颜色参数中的b*值和雾度指数(Haze值)分别低至7.37和0.56。

Trifluoromethyl amide-containing tetracarboxylic dianhydride(TA-TFMB) was synthesized by acylation reaction of 2,2′-bis(trifluoromethyl)-4,4′-benzidine(TFMB) and trimellitic anhydride chloride(TMAc), then a series of poly(amide-imide)(PAI) films were prepared by one-step copolymerization of TA-TFMB with 4,4′-diaminodiphenyl ether(ODA) and TFMB. The PAI films were characterized by dynamic thermomechanical analysis(DMA), differential scanning calorimetry(DSC), thermogravimetric analysis(TGA) and optical properties test. The results show that the PAI films have good thermal and optical properties, the glass transition temperature is 307.0~320.5 ℃, and the 5% thermal decomposition temperature is 449.0~471.0 ℃ in nitrogen atmosphere. The linear thermal expansion coefficient(CTE) of PAI-ODA is about 17.63×10^-6/K, which is consistent with the CTE of common copper foil(17.0×10^-6/K).The PAI-TFMB has the highest transmittance(85.43%) in the PAI films, and its color parameter b*and Haze value is 7.37 and 0.56, respectively.