3T.Hattori. Particle Reduction in VLSI Manufacturing,Contamination Control and Defect Reduction in Semiconductor Manufacturing Ⅲ[M].Pennington,NJ:The Electrochemical Society,1994.3.
4韩郑生.半导体制造技术[M]北京:电子工业出版社,2004.
5Kern W. Handbook of semiconductor wafer cleaning technology:science,technology and applications[M].New Jersey:Noyes Publication,1993.
6Ohim T. Total room temperature wet cleaning for Si substrate surface[J].Journal of the Electrochemical Society,1996,(09):2957-2964.doi:10.1149/1.1837133.
7Okumura H,Akane T,Tsubo Y. Comparison of conventional surface cleaning methods for Si molecular beam epitaxy[J].Journal of the Electrochemical Society,1997,(11):3765-3768.doi:10.1149/1.1838088.
8李家值.半导体化学原理[M]北京:科学出版社,1980.
9Maleville C,Moulin C,Delprat D. 12th International symposium on Silicon-on-Insulator technology and devices[J].Journal of the Electrochemical Society,2005,(03):357.
10Inomata C R,Ogawa H,Ish ikawa K. Infrared spectroscopy study of chemical oxides formed by asequcnce of RCA standard cleaning treatments[J].Journal of the Electrochemical Society,1996,(09):2995-3009.
