摘要
如今,所有汽车都配备了半导体。每一辆出厂汽车拥有超过50个半导体。博世最新研发的新型碳化硅(Sic)微芯片(见图1)将助力电动车实现质的飞跃。未来,由这种非常规材料制成的芯片将引领电动车和混合动力汽车的控制系统,即功率电子器件的发展。与目前使用的硅芯片相比,碳化硅具有更好的导电性,在实现更高的开关频率的同时保持更低的热损耗。"碳化硅半导体为电机提供更多动力。
Nowadays,all cars are equipped with semiconductors.Over 50 pieces of semiconductors are owned by each car coming out of a factory.The new SiC,microchip most newly invented by Bosch,will assist electric car to realize a qualitative leap.In the future,the chip made from this non common material will lead the control system of electric and hybrid power drive cars,namely the development of power electronic devices.Compared with Si chips currently in use,the SiC has better conductivity,and maintains lower thermal consumption,at the same time,achieves even higher switching frequency.
出处
《汽车零部件》
2019年第10期93-93,共1页
Automobile Parts
