环氧化合物改性大豆蛋白胶黏剂制备工艺与性能研究

Study on Process Conditions and Properties of Soy Protein Adhesives Modified by Epoxy Compound

通过三羟甲基丙烷三缩水甘油醚(THPTG)交联聚合大豆蛋白降解液制备低黏度大豆蛋白胶黏剂,研究THPTG用量、反应时间、反应温度等工艺参数对大豆蛋白胶黏剂黏度、耐水胶合强度和固化性能的影响,优化大豆蛋白胶黏剂制备工艺条件。结果表明:THPTG用量与反应时间对大豆蛋白胶黏剂黏度、耐水胶合强度均有显著影响,而反应温度仅对黏度影响较大;THPTG用量为9%时,大豆蛋白胶黏剂固化温度为130.20℃,固化反应热达到最大值199.7J/g。大豆蛋白胶黏剂优化的制备工艺条件为THPTG 9%、反应时间50 min、反应温度70℃,制备的胶黏剂黏度为106 mPa·s,耐水胶合强度达到0.76 MPa,满足GB/T 9846-2015对于Ⅱ类胶合板标准要求。

Low-viscosity soy protein adhesive was prepared by crosslinking the degraded soy protein and trimethylolpropane triglycidyl ether(THPTG). In order to optimize the preparation conditions of soy protein adhesives, the effects of processing parameters such as reaction time, reaction temperature, and THPTG dosage on the viscosity, bonding strength, and curing performances were investigated in this work. The results indicated that THPTG dosage and reaction time showed significant effects on the viscosity and bonding strength of soy protein adhesive, while the reaction temperature only influenced the viscosity. When the THPTG dosage was controlled at 9 wt%, the adhesive exhibited the lowest curing temperature of 130.20 ℃, and the curing enthalpy is 199.7J/g. The optimum preparation conditions of soybean protein adhesive are 9 wt %THPTG, reaction time of 50 min, and reaction temperature of 70 ℃. the resulting adhesive had a relatively lower viscosity of 106 mPa·s and its bonding strength value reached 0.76 MPa, which can meet the GB/T 9846-2015 standard for type II plywood.