粘片工艺对QFP封装可靠性的影响

Effect of Adhesive Technology on the Reliability of QFP Packaging

集成电路封装行业的快速发展对粘片后产品的质量与可靠性提出了更高的要求,粘片工艺对集成电路可靠性有着至关重要的影响。采用单一控制变量法,研究硅微粉含量对QFP(Quad Flat Package)封装可靠性的影响;利用正交试验工具,探究在粘片工艺中,不同的胶层厚度和胶层面积对QFP封装后可靠性的影响。研究发现,添加适量的硅微粉有助于提高环氧模塑料对QFP封装后的可靠性;粘片工艺中,当胶层厚度为30μm、胶层面积大于或等于芯片面积时,QFP封装后的可靠性最好。

The rapid development of IC packaging industry has put forward higher requirements on the quality and reliability of the products after gluing. A single control variable method was used to study the influence of silicon powder content on the reliability of QFP(Quad Flat Package) packaging. The influence of different thickness and area of adhesive layer on the reliability of QFP packaging was investigated by using orthogonal test tool. It was found that adding proper amount of silicon powder could improve the reliability of epoxy molding compounds for QFP packaging. When the thickness of the adhesive layer is 30 microns and the area of the adhesive layer is greater than or equal to the chip area, the reliability of QFP packaging is the best.