球栅阵列封装器件振动弯曲变形工艺实验研究

开展了随机振动环境条件下PCB板动态弯曲行为对球栅阵列封装器件焊点可靠性影响研究;通过评估PCB板固有频率计算印制板最大动态弯曲挠度,并利用连接器压接机改进与优化设计开展试验件弯曲变形试验。最终通过电性能测试与金相剖切方法评估振动弯曲对球栅阵列封装器件焊点界面影响。

The effect of dynamic bending behavior of PCB board on the reliability of Ball Grind Array package device under random vibration environment was studied.The maximum bending deflection of PCB board is calculated by evaluating the natural frequency of PCB board.Moreover,by improving and optimizing design of the connector pressfit machine to conduct PCB board bending experiment.Finally,the effects of PCB vibration bending on the solder joint interface of the Ball Grind Array device were evaluated by electrical performance test and metallographic sectioning method.