大尺寸板状构件超声阵列悬浮技术

Ultrasonic array levitation technology for large size plate like components

为了提高超声悬浮性能及其柔性化应用能力,满足包括集成电路硅片和太阳能电池极板等构件的非接触抓取和输运的应用需求,开展基于换能器阵列的大尺寸板状构件超声悬浮技术研究.采用空间脉冲响应函数法,建立换能器阵列非自由超声场的声压分布及该声场内悬浮体所受声辐射力的理论表达式,结合COMSOL软件进行仿真研究,验证该理论表达式的正确性.搭建基于换能器阵列的超声悬浮实验装置,分别开展同一激励电压不同尺寸硅片以及同一尺寸硅片不同激励电压下的声悬浮实验.结果表明:该技术可以实现对尺寸远大于波长的物体在稳定高度的超声悬浮,且当悬浮体的重量小于超声阵列的最大负载能力时,悬浮高度随物体尺寸和激励电压的变化不明显.

In order to increase the ultrasonic levitation performance and its flexible application ability,and satisfy the noncontact grasping and transportation application requirements for the components including but not limited to integrated circuit silicon wafer and solar cell plate,a ultrasonic levitation technology based on the transducer array for large size plate like components was studied.Using the spatial impulse response method,the theoretical expressions for transducer array’s sound pressure distribution in non-free ultrasonic field and the acoustic radiation force at levitated object were established.These theoretical expressions’correctness was verified by simulation results of COMSOL software.The ultrasonic levitation experimental device based on the transducer array was set up,and the acoustic levitation experiments for variable size silicon wafer under the same excited voltage and fixed size silicon wafer under variable excited voltages were carried out.Experimental results show that the proposed technology can realize stable height ultrasonic levitation of object whose size is far larger than the wavelength,and when the levitated object’s weight is less than the ultrasonic array maximum load capacity,the levitation height is not obvious related to the object size and the excited voltage.